SMD291SNL250T5

产品参数

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表格

Jar, 8.8 oz (250g)

型号

Solder Paste

系列

-

重量

0.551 lb (249.93 g)

进程

Lead Free

直径

-

焊剂类型

No-Clean

保质期

6 Months, 2 Months

线规

-

构图

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

零件状态

Active

熔点

423 ~ 428°F (217 ~ 220°C)

订购人信息

Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.

Digi-Key存储

Refrigerated

货架期开始

Date of Manufacture

存储/制冷温度

37°F ~ 46°F (3°C ~ 8°C)