SMDLTLFP50T3

产品参数

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表格

Jar, 1.76 oz (50g)

型号

Solder Paste

系列

-

重量

0.113 lb (51.26 g)

进程

Lead Free

直径

-

焊剂类型

No-Clean

保质期

6 Months, 2 Months

线规

-

构图

Bi57.6Sn42Ag0.4 (57.6/42/0.4)

零件状态

Active

熔点

281°F (138°C)

订购人信息

Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.

Digi-Key存储

Refrigerated

货架期开始

Date of Manufacture

存储/制冷温度

37°F ~ 46°F (3°C ~ 8°C)